Kontaktlose vacuum cup
SMC non-contact vacuum pads enable breakthrough handling of highly sensitive components. Based on the Bernoulli principle, the workpiece is lifted without direct contact, completely eliminating scratches, marks, or contamination. This is the ideal solution for semiconductor manufacturing, photovoltaics, and wafer handling.
- Non-contact handling based on the Bernoulli principle
- No mechanical damage or contamination
- High process purity for cleanroom applications
- Secure transport of highly sensitive wafers and foils
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